Latest Headlines

  1. Cheer Pack North America Is Pleased To Announce The Launch Of Its New CHEERPlus Bevels Cap

    Cheer Pack North America (CPNA) is pleased to announce the launch of its new CHEERPlus Bevels cap, which is available for use on most CHEER PACK® flexible packaging products

  2. Cambrex Doubles cGMP Liquid Filling Capacity At Its Mirabel, Québec Facility

    Cambrex Corporation (NYSE: CBM), the leading small molecule company providing drug substance, drug product and analytical services across the entire drug lifecycle, today announced it will double the liquid packaging capacity and weekly output at its Mirabel, Québec site in Canada with the addition of a cGMP packaging line and a new filler on the existing packaging line. By June 2019, the monthly capacity will be 1.2 million bottles compared with approximately 600,000 per month today

  3. A*STAR And Soitec Launch Joint Program To Develop A New Layer Transfer Process For Advanced Packaging

    The Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics (IME) and Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, announce the launch of a joint program to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques

  4. Sealed Air And Kuraray To Invest In New Production Capacity For Plantic Plant-Based Food Packaging

    Sealed Air Corporation is investing in capacity at its Simpsonville, S.C. facility to produce plant-based food packaging. This facility will be the first in North America to produce materials made from Plantic plant-based resin and post-consumer plastic 

  5. The Sterling Group Completes The Acquisition Of Polychem Corporation

    The Sterling Group, an operationally focused middle market private equity firm, today announced the acquisition of Polychem Corporation. Polychem is a leader in the securement packaging industry

  6. ThreatConnect Releases New Pricing And Packaging Of Its Intelligence-Driven Security Operations Platform

    Disrupting the cybersecurity industry since 2011, ThreatConnect, Inc., provider of the industry’s only intelligence-driven security operations platform, is proud to announce its new product packaging designed to bring value to all members of the security team: threat intelligence, incident response, security operations, and security leadership

  7. ProAmpac Announces Four New Sustainable Packaging Product Groups

    ProAmpac today announced it has developed a suite of sustainable product groups as part of the company’s commitment to increasing environmentally sound and sustainable flexible packaging solutions. This press release features multimedia. View the full release here: ProActive Sustainability products (Photo: Business Wire) “We are advancing our corporate commitment to deliver and develop the sustainable flexible packaging that our customers and their consumers want and need,” said Adam Grose, chief commercial officer. The

  8. OrCon Industries Expands Service Offering, Acquires AC Packaging

    OrCon Industries Corporation acquired AC Packaging on January 31, 2019. With this acquisition, OrCon is expanding its product and service offering to include on-site crating, doubling its wooden packaging production space and adding its third plant in Rochester, NY

  9. Custom Cosmetic Packaging, Makeup Packaging Solutions From Morewin

    Morewin, industry leaders in custom packaging of cosmetics, makeup products and health care products are pleased to present a range of packaging solutions for their clients. The packaging solutions include compact containers, lotion bottles, cream jars, perfume bottles, roll-on bottles, hair care and skin care packaging, cosmetic dropper bottles and many more

  10. CPS Technologies Corporation To Exhibit At iMAPS Device Packaging And The Applied Power Electronics Conference And Exposition

    CPS Technologies Corporation (Nasdaq:CPSH), a world leader in combining metals and ceramics to improve performance and reliability of applications in a variety of electrical system applications, is pleased to announce our attendance and exhibition at the iMAPS International Conference and Exhibition on Device Packaging (DPC) on March 4-7, 2019 and the Applied Power Electronics Conference and Exposition (APEC) on March 17-21, 2019