Seminar to Show Benefits of Molded Pulp Packaging

The only forum fully dedicated to molded fiber packaging comes to Chicago November 18-19. Sponsored by the International Molded Pulp Environmental Packaging Association (IMPEPA), the Fourth International Seminar on Molded Pulp Packaging will provide insights on a range of topics dealing with this environmentally friendly packaging material.

Information will be provided on such topics as the use of pulp additives, FDA and recycled materials, molding machines and processes, pulp design, molded pulp in food packaging, designing without cushion curve data and the molded pulp market in general. Users will also share their experiences with molded pulp.

Attendees are anticipated as being primarily potential users of molded pulp packaging as well as molders and molding equipment suppliers. The conference is designed to benefit packaging engineers developing new packages, packagers concerned with environmental issues and recycling, molded pulp product manufacturers, purchasing managers and anyone seeking improvements in packaging.

The Fourth International Seminar on Molded Pulp Packaging will be held at the O'Hare Hilton and begin with a reception Thursday, November 18, from 5:30 – 7:00 pm. Then on Friday, November 19, the conference program will be as follows:

Friday, November 19
8:00-8:30 am: Continental Breakfast

8:30 am: Seminar Opens – Welcome – Announcements
Joe Grygny, Executive Director, IMPEPA

8:45 am: Molding Machines and Processes
David Tuke Hastings, VP, Silfurtun of Iceland

9:30 am: Mechanical Property Variables for Formed Fiber Packaging
John Hunt, ME-Research Scientist, U.S. Forest Products Laboratory

10:15: Break

10:30 am: Food & Drug Administration Guidelines for Recycled Paper Packaging Products
George Misko, Partner, Keller & Heckman

11:15 am: Grease and Moisture Resistant Slurry Additives
Chang Jho, Ciba Specialty Chemicals

12:00 pm: Lunch

12:45 pm: Demonstration of the Performance of a Molded Pulp Package Designed by Formula
Dr. Jorge Marcondes, San Jose State University

1:30 pm: Molded Pulp Packaging at the Coleman Products Co.
Jody Leser, Packaging Engineer, Coleman Co.

2:15 pm: New Low-Cost Prototype/Sample Transfer Molding Machine
Gene Goldman, ME-V.P., Core Engineering

3:00 pm: Break

3:15 pm: Packaging Case Study - Ameristar Package Winner
Paul Pierson, CPP, Organon-Teknika Corp.

3:45 pm: Marketing Molded Pulp Packaging Products
Joe Grygny, Executive Director, IMPEPA

4:30 pm: Open Forum - Questions, Comments, Suggestions

5:00 pm: Seminar Ends

Registration costs are $395 for IMPEPA members and $495 for non-members. Registration and hotel reservations should be made by November 3.

For more information: IMPEPA, Tel: 414-241-0522, Fax: 414-241-3766, Email: grygny@execpc.com.

Edited by Bill Noone