PACK EXPO 2000: Blister Packaging

The company will feature a number of packaging solutions for mass retailers at PACK EXPO 2000. They will feature a number of innovations including cost-effective, machine-applied blister labeling, bar code blister card scanning and "Quick Change" tooling features from the industry's leading thermoformer and packaging machinery manufacturer.

A complete three-dimensional virtual tour of the booth can be viewed via the world wide web and www.alloyd.com. Visitors can view the booth to see machinery, displays and access product information, available online now and continuing through the show.

In operation at the show will be the 16SC1216 Carousel Machine, which will feature two different blister packages running on combination heat seal tooling and demonstrate "Quick Change" tooling allowing rapid changeovers.

An 8SC1216 Rotary Machine will demonstrate features including PLC control with Auto Start/Auto Purge, bar code scanning for compliance and "Quick Change" tooling.

Also part of the display will be the new 2SM1428 Medical Machine, with CE certification, Level 3 Control, easy glide tray and touch screen interface. A custom medical tray will be running on the unit. The new 4SC69 with CE certification and "Quick Change" tooling will also be featured.

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