Molded Pulp Packaging Seminar Kicks Off Thursday
The 3rd International Molded Pulp Packaging Seminar, which takes place Thursday, March 18, and Friday, March 19, at the O'Hare Hilton in Chicago, will focus on the manufacture and uses of molded pulp derived from recovered paper. The only seminar dedicated solely to molded fiber packaging, the forum will provide up-to-date information and trends on molded pulp as a medium for protective packaging.
The conference is sponsored by the International Molded Pulp Environmental Packaging Association (Mequon, WI). An array of speakers will provide information on the pulp molding process with video descriptions, mold design and variations, and worldwide environmental issues. Case studies of applications will also be presented.
Expected to be on hand will be users and producers of molded pulp packaging as well as equipment manufacturers. A variety of samples of various types of molded pulp packaging products will also be on display. The conference kicks off Thursday evening with a reception, and a full slate of seminar sessions will be presented on Friday. Topics and speakers include:
• Thermoformed Fiber/Transfer Molding Machines, Eddie Viskaal Markhorst, Holland Co., Hardenberg, Netherlands.
• 3D Scanning for Mold Development, Felice Chiapperini, Romer Corp., Carlsbad, CA.
• Mold Manufacturing Techniques, Harry Pearson, Pulp Molding Dies Co., Ajax, Ontario, Canada.
• Functional Molded Pulp Product Design, Dr. Jorge Macondes, San Jose State University, San Jose, CA.
• Solid Modeling Procedures for Molded Pulp, Salahuddin Khan, Ecoform Inc., Walpole, MA.
• National & International Developments of Environmental Regulations, Victor Bell, Jamestown, RI.
• Molded Pulp Industry in China, Mrs. Liyan Xu, Pulp Molding Machinery & Products Association of China, Beijing, China.
• Molded Pulp Packaging at Motorola, Bill Duncan, Motorola Corp., handler, AZ.
• Molded Pulp Case Study, Les Bisgrove, Snap-on Tool Co., Kenosha, WI.
The cost of this seminar is being underwritten by IMPEPA except for out-of-pocket expenses, which will be covered by the nominal tuition charge of US$350 for IMPEPA members and US$450 for non-members. Seminar roceedings are available.
For more information: IMPEPA, Tel: 414-241-0522, Fax: 414-241-3766, Email: grygny@execpc.com