News | December 18, 2019

Micross Advanced Interconnect Technology, Research Triangle Park, NC Receives DMEA Microelectronics Trusted Source Certification For Packaging & Assembly Services

Micross Advanced Interconnect Technology, Research Triangle Park, NC Receives DMEA Microelectronics Trusted Source Certification for Packaging and Assembly Services under Category 1A

Orlando, FL (PRWEB) - Micross is pleased to announce that its Advanced Interconnect Technology operation (Micross AIT) located in Research Triangle Park, North Carolina has been accredited by the Defense Microelectronics Activity (DMEA) as a Microelectronics Trusted Source for Packaging and Assembly Services (Category 1A) effective December 13, 2019.

Micross AIT houses an ITAR-registered, state-of-the-art AS9100D/ISO9001:2015 certified microfabrication facility that provides development, custom (flexible) prototyping and production services for a wide variety of Defense and Hi-Reliability customers.

Micross AIT supports multiple advanced interconnect and assembly technologies facilitating next-generation electronic systems, including wafer level packaging processes for solder (Pb-based and Pb-free) and Cu pillar bumping, high density (fine pitch) interconnects, through silicon vias (TSV) and silicon and glass interposers. Together, these capabilities support a breadth of 2.5 and 3D heterogeneous integration packaging options. Micross AIT works with commercial, private, and government customers to provide unique solutions to challenging interconnect and packaging requirements. With this certification, Micross AIT can now serve designated Trusted Programs as a post-CMOS processing services provider.

"Micross AIT is extremely proud to obtain this accreditation. This reflects the integrity, pride and hard work of the AIT Team. For more than 25 years, Micross AIT has been at the cutting-edge in the development and implementation of interconnect and packaging technologies; this certification re-confirms our critical Mission in support of the Defense Industrial Base (DIB),” stated John Lannon, General Manager of Micross AIT.

For additional information about Micross AIT and all its capabilities, visit or contact Alan Huffman, Director of Engineering at

About Micross
Micross ( is the global one-source provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our extensive hi-reliability capabilities serve the Aerospace & Defense, Space, Medical and Industrial markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle.

Source: PRWeb

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