Product/Service

Low-Temperature, Hot Melt Adhesive

Source: National Starch and Chemical Company

Cool-Lok is a low-temperature, hot melt adhesive that reduces that usage from 20% to 50%, allowing for a significant cost reduction.
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Cool-Lok is a low-temperature, hot melt adhesive that reduces that usage from 20% to 50%, allowing for a significant cost reduction. Savings can also be accrued through dramatically lower replacement costs for applicator parts such as hoses, guns and nozzles. This can easily amount to thousands of dollars per year. Cost savings also result from reduced downtime and labor associated with nozzle clogging and parts replacement.

Customers appreciate this special adhesive because it does not form char. When consumer products need to appear clean and sterile, darkly colored adhesive is not acceptable. Charring frequently results when conventional hot melt adhesives that require heating to 350ºF (176ºC) are used. Conventional 350º hot melt adhesives emit volatiles that contribute to odors that plant personnel have had to live with until products such as this adhesive were introduced. Adhesive customers appreciate the absence of odors associated with volatiles and charred adhesive.

National Starch and Chemical Company, 10 Finderne Avenue, P.O. Box 6500, Bridgewater, NJ 08807-3300. Tel: 800-797-4992; Fax: 609-409-5699.

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