Event Detail
Lamination of Thin Webs for Packaging
August 18 - 19, 2010
- Philadelphia NJ UNITED STATES
Seminars for Engineers
Seminars For Engineers announces, in association with Dr. Duncan Darby of Clemson University, the 2010 dates for its new seminar “Lamination of Thin Webs for Packaging.” This two-day seminar will give engineers a comprehensive understanding of lamination processes and how they are applicable to flexible packaging. Lamination can often provide a better result for flexible packaging than monolayer materials can and is a very important technique to understand. Topics covered are wetting and its impact on adhesion; extrusion vs. adhesive lamination; rationale for lamination; bond testing; bond failure mechanisms; and alternatives to laminating.