Find Out What's New At PACK EXPO International 2014

Find Out What’s New at PACK EXPO International 2014

Whether they are contending with changing regulatory environments or striving to meet customer demands for greater sustainability measures, the ways CPGs and other product manufacturers address today’s challenges will impact future success.

This fall, PACK EXPO International 2014 (November 2-5; McCormick Place, Chicago), North America’s largest processing and packaging event, will serve as a hub for the innovation manufacturers need. And, bolstered by the debut of the co-located Pharma EXPO, PACK EXPO will offer unique opportunities for new ideas and innovations to cross between industries.

PACK EXPO is owned and produced by PMMI, The Association for Packaging and Processing Technologies.

To help brand owners, processors, and manufacturers more easily navigate the 1.15 million net square feet of exhibit space and locate the packaging solutions and suppliers they need, PACK EXPO International includes industry-specific pavilions and features such as The Reusable Packaging Pavilion. Hosted by the Reusable Packaging Association (RPA) and located in the Lakeside Upper Hall, this pavilion will highlight the advantages of reusable packaging, such as reducing waste, cutting shipping costs, protecting goods and increasing productivity.

PACK EXPO features other pavilions and lounges as well, such as The Confectionery Pavilion and The Baking-Snack Break Lounge. The lounges will serve as dedicated networking hubs for specific industries. Regardless of the market segments you serve, you’ll find plenty to help you reach your business goals:

• The Brand Zone (Upper North Hall) will help brand owners break the mold, with innovative containers and materials to interrupt the retail landscape, broaden your appeal, enhance your shelf presence and extend shelf life. The 11th Annual Showcase of Packaging Innovations, sponsored by the Dow Chemical Company, will display an inspiring array of award-winning package designs from all over the world.
• The Processing Zone (Upper Lakeside) is a hub spotlighting the latest in processing technology. But PACK EXPO is about encountering innovation across your entire supply chain and you’ll find suppliers who can help you develop total systems solutions throughout the exhibit halls.
• The Reusable Packaging Pavilion (Upper Lakeside) will offer ways for you to explore methods of reducing waste, slashing shipping costs, protecting your goods, and increasing productivity and your bottom line. Whether you are looking to newly invest in reusable packaging or get more out of assets you already own, this pavilion is an excellent place to start.
• There will be an abundance of free educational opportunities at PACK EXPO International. Seminars on breakthrough technologies and techniques with applications in a wide variety of industries will be featured at three Innovation Stage locations throughout PACK EXPO alone. The Food Safety Summit Resource Center (Booth # S-2962), organized and owned by Food Safety Summit and co-sponsored by GE Intelligent Platforms, will present subject matter experts on critical food safety matters like the Global Food Safety Initiative (GFSI) and compliance with the Food Safety Modernization Act (FSMA). At the Center for Trends & Technology (CTT) (Booth # S-3907) you can learn about the absolute latest technologies and emerging trends on topics such as machine safety, the Internet of Things, serialization and line optimization.

Here is a sneak peek of just some of the innovations you can expect to see at the show:

• New 2-D Barcode Works With or Without Internet Access
  The patented HD Barcode from Complete Inspection Systems (Booth # N-5804) can store up to 175 times more data than traditional 2-D codes. Using a proprietary reading application, an authorized user can scan, read and verify product details from any location. Manufacturers can include track and trace information, product specifications, e-pedigree data, plant location, manufacture date, distribution regions, package, carton or label identifiers, user data, full color images and marketing incentives.
• Durable, Sanitary Actuators
  Designed specifically for food and beverage packaging, the new Stainless Steel Flat-1 actuators from Bimba (Booth # S-1554) are highly resistant to corrosive foams and spray used during washdown activities. The components comply with current USDA and 3-A requirements that state non-product contact areas must be corrosion resistant, and the unitized body design of the actuators eliminates the need for tie rods, which can trap food product and create areas for bacterial growth.
• High-res Inkjet System Delivers Sharper, Darker Print
  Squid Ink (Booth #S-2775) will introduce its CoPilot ink jet printing system at PACK EXPO this year. The technology can print up to .7 inches of high-resolution characters, razor-sharp text, scannable bar codes and logos at 185 dpi. The CoPilot is capable of running oil- or solvent-based inks on a variety of substrates, provides darker print for increased scannability, and features a durable touchscreen console and stainless steel cabinet.
• High Performance Film Resists Corrosion and Punctures
  The new High Performance VCI Shrink Film from Daubert Cromwell (Booth # E-8135) easily adheres to a wide range of equipment in metalworking industries. The VCI’s combination of flexibility and strength is ideal for packaging items with sharp edges or irregular shapes. The film is also corrosive-resistant and seals quickly, providing manufacturers with maximum throughput and productivity.

To register for PACK EXPO International 2014, visit packexpointernational.com. A discounted registration rate of $30 applies until Oct. 3, when it increases to $60.